UV Laser machine
UV Laser machine:
Food and medicine packing material marking,drilling tiny hole(hole diameter d≤10μm)
Soft PCB marking and slicing.
Metal and nometal thin film removal.
Silicon wafer tiny hole and dead hole processing.
Specification of UV laser machine:
Laser power: 8w/10w/12w/20w
Wavelength: 355nm
Marking speed: ≤7000mm/s
Min. line width: 0.01mm
Repeat accuracy: ±0.003mm
Cooling system: high accuracy, constant temperature/ circle chiller.