"Laser Slicer is widely used for industries of solar wafer and semiconductor, specially in silicon wafer process industrial.
High quality laser beam, thin facula and small heating affection.
Cutting scope: 200x200mm, 300X300mm.
Cutting depth: 0.3mm
Cutting width: 0.1mm
Max cutting speed: 100mm/s
Accuracy: +/-0.01mm."
